Benefits of Baking Profiling Improves product consistency, minimizes waste, reduces energy consumption and cost, facilitates process reproducibility, enables minimization of ingredients, and increases line profitability.
The V-M.O.L.E.® is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings. V-M.O.L.E.® also boasts the same powerful M.O.L.E.® MAP software created for the MEGAM.O.L.E.® 20 thermal profiler, including the Target-10 feature, and of course, the patented “OK-Button”…the world's only one-touch Go/No-Go indicator of profile compliance to pre-programmed specification.
V-M.O.L.E.® is both RoHS compatible and compliant. Time is money. V-M.O.L.E.® saves both!
SuperM.O.L.E.® Gold 2 continues the legacy of the original SuperM.O.L.E.® Gold Thermal Profiler. With all the power of a MEGAM.O.L.E.® 20, it retains the same form factor, thermocouple connector type, channel count (6), and RIDER-product compatibility.
Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of your .MDM M.O.L.E. libraries and compatibility with your intranet, Excel, and all ECD M.O.L.E.® profilers? The MEGAM.O.L.E.® delivers your specifications in a sleek 7.2mm thin package with patented productivity enhancing features that will give you the edge in R&D decision making to WOW Management, Customers and your OEM-EMS QA linkage.
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, ECD's work-horse thermal profiler.
“MAP” stands for Machine (reflow oven), Assembly (test article) and Process (solder paste). Our aim is to help Engineers optimize their Machine-Assembly-Process, and we know that time is money. M.O.L.E.® MAP software is designed to be Easy-to-Use, Flexible and Robust…no small undertaking.
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER® NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER® NL 2 process pallet.
Look to ECD’s OvenRIDER® NL 2 if you need to VERIFY an oven’s performance:
Regardless of the recipe and what your oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANTLY different. Achieve convection reflow oven Verification by separating zonal temperatures from convective heat flow efficiency while verifying conveyor speed for a true picture of oven Lead-Free performance consistency.
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